EW8002 NoSWEEP™ Wire Bond Encapsulant
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产品名称: EW8002 NoSWEEP™ Wire Bond Encapsulant
产品型号: EW8002
产品展商: 其他品牌
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简单介绍
EW8002 NoSWEEP™ Wire Bond Encapsulant
的详细介绍
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
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